Researchers have laid the foundation for super fast computing by developing a one-atom-thin silicon transistor. The single-atom thick layer of silicon has been named as silicene and it is the thinnest silicon material of the world. Researchers from the University of Texas at Austin’s Cockrell School of Engineering believe that their creation might pave the way for building smaller, dramatically faster and more efficient computer chips. This new development has been detailed in the journal Nature Nanotechnology.
Researchers have noted that silicon has some outstanding properties which can be very useful for conducting electricity. However, dealing with it has been quite difficult till now. Working with silicon is tough as it becomes unstable when exposed to air. To resolve this issue, a new way of fabricating silicene has been developed by the scientists, which decreases the materials’ exposure to oxygen.
The research has been carried out by Deji Akinwande of the University of Texas Austin and his team. Akinwande stated “The major breakthrough here is the efficient low-temperature manufacturing and fabrication of silicene devices for the first time.” The research team opines that this new technology will be helpful in developing super-fast computing solutions. Several electronic circuits and computer chips are created with silicon and using silicene in such technologies should be easy.